microelectromechanical systems
microelectromechanical systems platform for fully integrated, on - chip, vacuum electronic devices .
research, design, develop, or test microelectromechanical systems (mems) devices .
consider environmental issues when proposing product designs involving microelectromechanical systems (mems) technology .
plan or schedule engineering research or development projects involving microelectromechanical systems (mems) technology .
fabrication of 3d carbon microelectromechanical systems (c - mems). - pubmed - ncbi
2. the method of claim 1 wherein the structure is a microelectromechanical systems structure .
microelectromechanical systems and neurosurgery: a new era in a new millennium. - pubmed - ncbi
cited from journal of microelectromechanical systems, vol. 12, no. 6, december 2003
develop or file intellectual property and patent disclosure or application documents related to microelectromechanical systems (mems) devices, products, or systems .
all - organic microelectromechanical systems integrating specific molecular recognition - - a new generation of chemical sensors .
propose product designs involving microelectromechanical systems (mems) technology, considering market data or customer requirements .
manage new product introduction projects to ensure effective deployment of microelectromechanical systems (mems) devices or applications .
figs. 1 a - d depict the formation of a released microelectromechanical systems (mems) structure .
note: a silicon - on - insulator microelectromechanical systems probe scanner for on - chip atomic force microscopy .
brain imaging using a portable 2. 9 g two - photon microscope based on a microelectromechanical systems scanning mirror
conduct experimental or virtual studies to investigate characteristics and processing principles of potential microelectromechanical systems (mems) technology .
development of an alternating magnetic - field - assisted finishing process for microelectromechanical systems micropore x - ray optics .
an object of the invention is to provide a method for releasing a microelectromechanical systems (mems) structure .
chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems (journal article) | osti. gov
all - organic microelectromechanical systems integrating specific molecular recognition - - a new generation of chemical sensors. - pubmed - ncbi
refine final microelectromechanical systems (mems) design to optimize design for target dimensions, physical tolerances, or processing constraints .
develop or implement microelectromechanical systems (mems) processing tools, fixtures, gages, dies, molds, or trays .
devise microelectromechanical systems (mems) production methods, such as integrated circuit fabrication, lithographic electroform modeling, or micromachining .
identify, procure, or develop test equipment, instrumentation, or facilities for characterization of microelectromechanical systems (mems) applications .
note: a silicon - on - insulator microelectromechanical systems probe scanner for on - chip atomic force microscopy. - pubmed - ncbi
development of an alternating magnetic - field - assisted finishing process for microelectromechanical systems micropore x - ray optics. - pubmed - ncbi
xenon difluoride is also used as a gaseous etchant for silicon, particularly in the production of microelectromechanical systems, (mems) .
used as fluorinating agent and oxidizing agent, gaseous etchant for silicon, particularly in the production of microelectromechanical systems (mems) .
create schematics and physical layouts of integrated microelectromechanical systems (mems) components or packaged assemblies consistent with process, functional, or package constraints .
investigate characteristics such as cost, performance, or process capability of potential microelectromechanical systems (mems) device designs, using simulation or modeling software .
validate fabrication processes for microelectromechanical systems (mems), using statistical process control implementation, virtual process simulations, data mining, or life testing .
the present invention relates to microelectromechanical systems (mems), and more particularly, the present invention is related to semiconductor manufacturing techniques and mems .
the thermally conductive epoxy thermally couples the microelectromechanical resonator to the temperature sensor such that the temperature sensor generates data which correlates to the temperature of the microelectromechanical resonator .
embodiments of the present invention relate generally to the fabrication of packaged timing references and particularly to a packaging configuration for micro - electromechanical systems (mems) and nano - electromechanical systems (nems) resonator systems .
[ 0001 ] this invention relates to microfabrication. in particular, it relates to the microfabrication of a structure for a microelectromechanical systems (mems) device .
microelectromechanical systems or mems is the technology of very small devices such as sensors and microelectronics. specialist facilities within controlled environments are essential to create these devices .
advanced materials and fabrication methods for microelectromechanical systems, under the auspices of the national materials advisory board, was convened to undertake this study and write this report .
[ 2, 3 ], point of care medicine [ 4 ], and space exploration [ 5 ]. the use of microelectromechanical systems (mems) for
research or develop emerging microelectromechanical (mems) systems to convert nontraditional energy sources into power, such as ambient energy harvesters that convert environmental vibrations into usable energy .
develop formal documentation for microelectromechanical systems (mems) devices, including quality assurance guidance, quality control protocols, process control checklists, data collection, or reporting .
oversee operation of microelectromechanical systems (mems) fabrication or assembly equipment, such as handling, singulation, assembly, wire - bonding, soldering, or package sealing .
whether you need a slick surface for coating microelectromechanical systems (mems) or a sticky surface for semiconductor fabrication, chemical vapor deposition will provide the desired surface modification .
another object of the invention is to provide a method for quickly releasing a microelectromechanical systems (mems) structure using conventional wet and vapor hydrofluoric (hf) acid etching .
the novel process and material could be used in a wide range of applications from large components in jet engines and hypersonic vehicles to intricate parts in microelectromechanical systems and electronic device packaging .
wsn and hydrological natural disasters, wireless sensors and sensor systems in emerging hostile applications .
development of a cell cultureplatform in pdms: microfluidic systems for in vitro productionof platelets .
nelson w. , kim c. - j. “monolithic fabrication of ewod chips for picoliter droplets. ” journal of microelectromechanical systems. vol 20, 2011, pp. 1419 - 1427 .
through this degree you will learn the scientific and engineering principles underpinning a range of micro and nanoscale technologies with options to specialise in areas such as microelectromechanical systems, nanoelectronics, biodevices, or optoelectronics .
schmidt aa, chen xx, chen gg. contact thermal lithography. asme. asme proceedings, microelectromechanical systems (): 157 - 159. doi: 10. 1115 / imece2005 - 81748 .
development of microcomponents for attitude and communication systems on small vehicles in space and extreme environments .
bin tang and kazuo sato (march 28th 2012). advanced surfactant - modified wet anisotropic etching, microelectromechanical systems and devices nazmul islam, intechopen, doi: 10. 5772 / 26901. available from :
the process according to the present invention can be applied to produce semiconductors for microelectromechanical systems, for example, acceleration sensors, magnetic recording heads, ink jet printers, gyroscopes and other items as described above .
yield engineering systems, inc. (yes) > applications > surface modification > vapor phase deposition
williams, k. r. et al. ,
etch rates for micromachining processing ,
journal of microelectromechanical systems, vol. 5, no. 4, dec. 1996, pp. 256 - 269 .
these systems are all around us. they power the airbag sensors in our cars, accelerometers in our cell phones, and many sensors in the aviation industry. these tiny systems mix electronics with physical sensors, and plasma cleaning is an indispensable step in ensuring the reliability of these life saving systems .
acoustic focusing of microparticles in two - phase systems: towards cell enrichment or medium exchange in droplets .
cryogenic silicon etching has been commonly used in microelectromechanical systems (mems) research in order to etch high aspect ratio structures and deep, large features in silicon due to its high etch rate and high selectivity to resist and oxide masks .
w. nelson and c. - j. kim, “monolithic fabrication of ewod chips for picoliter droplets, ” journal of microelectromechanical systems, vol. 20, no. 6, december 2011, pp. 1419 - 1427. pdf
j. lee and c. - j. kim, “surface - tension - driven microactuation based on continuous electrowetting”, j. microelectromechanical systems, vol. 9, no. 2, june 2000, pp. 171 - 180 .
two - dimensional acoustic focusing of microparticles in two - phase droplet - based microfluidic systems increases particle detectability .
“the elionix electron beam lithography system will enable us to routinely write patterns of less than 10 nanometers in size, ” says dr. jacob trevino, asrc nanofabrication facility director. “we will count on this system to aid researchers in developing novel micro and nanoscale devices, such as nanophotonic and solid state circuits, microelectromechanical systems and microfluidic systems. ”
guangya zhou, hongbin yu, yu du, and fook siong chau ,
microelectromechanical - systems - driven two - layer rotary - blade - based adjustable iris diaphragm ,
opt. lett. 37, 1745 - 1747 (2012 )
yang y, li x. micro ultrasonic machining of ceramic mems with micro metallic dies. asme. asme international mechanical engineering congress and exposition, microelectromechanical systems (): 93 - 95. doi: 10. 1115 / imece2003 - 41635 .
b. shivkumar and c. - j. kim, “microrivets for mems packaging: concept, fabrication and strength testing”, j. microelectromechanical systems, vol. 6, no. 3, sept. 1997, pp. 217 - 225 .
maria teresa todaro, leonardo sileo and massimo de vittorio (march 9th 2012). magnetic field sensors based on microelectromechanical systems (mems) technology, magnetic sensors kevin kuang, intechopen, doi: 10. 5772 / 36468. available from :
the invention relates to the field of semiconductor processes. more specifically, the invention relates to hydrofluoric (hf) acid vapor etching release processes particularly suited for the reduction of stiction when releasing a microelectromechanical systems (mems) structure from a supporting substrate .
p. sen and c. - j. kim, “a liquid - solid direct contact low - loss rf micro switch”, j. microelectromechanical systems, vol. 18, no. 5, october 2009, pp. 990 - 997. pdf
p. sen and c. - j. kim, “a liquid - solid direct contact low - loss rf micro switch”, ? j. microelectromechanical systems, vol. 18, no. 5, october 2009, pp. 990 - 997. pdf
r. he and c. - j. kim, “on - wafer monolithic packaging by surface micromachining with porous polysilicon shell, ” j. microelectromechanical systems, vol. 16, no. 2, april 2007, pp. 462 - 472. pdf
microelectromechanical system (mems) technology, and surface micromachining in particular, have led to the development of miniaturized optical devices with a substantial impact in a large number of application areas. the reason is the unique mems characteristics that are advantageous in fabrication, systems integration, and operation of micro - optical systems. the precision mechanics of mems, micro... view full abstract»
y. - c. tai and c. - j. kim, “microelectromechanical systems (mems) ”, in the industrial electronics handbook, edited by j. d. irwin, crc press and ieee press, 1997, pp. 1468 - 1471 .
c. lee and c. - j. kim, “wetting and active dewetting processes of hierarchically constructed superhydrophobic surfaces fully immersed in water, ” journal of microelectromechanical systems, vol. 21, no. 3, june 2012, pp. 476 - 483. pdf
c. - j. kim, “microelectromechanical systems (mems) at the ucla micromanufacturing lab”, dig. papers, int. microprocesses and nanotechnology conf. (mnc’98), kyungju, korea, july 1998, pp. 54 - 55. (invited paper )
c. lee and c. - j. kim, “wetting and active dewetting processes of hierarchically constructed superhydrophobic surfaces fully immersed in water, ” journal of microelectromechanical systems, vol. 21, no. 3, june 2012, pp. 476 - 483. pdf
p. sen and c. - j. kim, “a fast liquid - metal droplet microswitch using ewod - driven contact - line sliding”, j. microelectromechanical systems, vol. 18, no. 1, february 2009, pp. 174 - 185. pdf
p. sen and c. - j. kim, “a fast liquid - metal droplet microswitch using ewod - driven contact - line sliding”, ? j. microelectromechanical systems, vol. 18, no. 1, february 2009, pp. 174 - 185. pdf
g. j. shah and c. - j. kim, “meniscus - assisted high - efficiency magnetic collection and separation for ewod droplet microfluidics”, j. microelectromechanical systems, vol. 18, no. 2, april 2009, pp. 363 - 375. pdf
miniaturized self - powering systems that integrate both energy harvesters and energy storage units as the power sources are essential to realize maintenance - free wireless sensor networks, implantable medical devices, and active radio frequency identification systems. on - chip micro supercapacitors (mscs) are promising candidates for energy storage in such systems by providing high power densities, f... view full abstract»
w. choi, v. rubtsov, and c. - j. kim, “miniature flipping disc device for size measurement of objects through endoscope, ” journal of microelectromechanical systems, vol. 21, no. 4, august 2012, pp. 926 - 933. pdf
g. j. shah and c. - j. kim, “meniscus - assisted high - efficiency magnetic collection and separation for ewod droplet microfluidics”, ? j. microelectromechanical systems, vol. 18, no. 2, april 2009, pp. 363 - 375. pdf
j. gong and c. - j. kim, “direct - referencing two - dimensional - array digital microfluidics using multi - layer printed circuit board”, j. microelectromechanical systems, vol. 17, no. 2, april 2008, pp. 257 - 264. pdf
j. simon, s. saffer, and c. - j. kim, “a liquid - filled microrelay with a moving mercury micro - drop”, j. microelectromechanical systems, vol. 6, no. 3, sept. 1997, pp. 208 - 216 .
w. choi, v. rubtsov, and c. - j. kim, “miniature flipping disc device for size measurement of objects through endoscope, ” journal of microelectromechanical systems, vol. 21, no. 4, august 2012, pp. 926 - 933. pdf
r. he and c. - j. kim, “a low - temperature monolithic encapsulation on wafer enabled by surface micromachining with porous alumina shell, ” j. microelectromechanical systems, vol. 18, no. 3, june 2009, pp. 588 - 596. pdf
demonstrate miniaturized systems that contain components such as microsensors, microactuators, or integrated electronic circuits fabricated on silicon or silicon carbide wafers .
two - dimensional acoustic focusing of microparticles in two - phase droplet - based microfluidic systems for improved particle positioning within spherical droplets .
chemical vapor deposition is a chemical process used to deposit a high purity solid material from the vapor phase and is commonly used in semiconductor - based technologies such as microelectronics and microelectromechanical systems (mems) for the deposition of a variety of thin films, including passivation and lubricant layers .
r. he and c. - j. kim, “a low - temperature monolithic encapsulation on wafer enabled by surface micromachining with porous alumina shell, ”? j. microelectromechanical systems, vol. 18, no. 3, june 2009, pp. 588 - 596. pdf
w. shen, r. t. edwards, and c. - j kim, “electrostatically - actuated metal - droplet microswitches integrated on cmos chip”, j. microelectromechanical systems, vol. 15, no. 4, aug. 2006, pp. 879 - 889. pdf
13. the packaging structure of claim 12, wherein the control chip compensates for changes in temperature of the microelectromechanical resonator using data from the temperature sensor .
[ 15 ] the release process of the microelectromechanical systems and devices is achieved by a complete dry etching process. the sequence of the release process flow is as shown in figure 1. the schematics of the cross - section view of the process flow are as depicted in figure 2 .
w. shen, r. t. edwards, and c. - j kim, “electrostatically - actuated metal - droplet microswitches integrated on cmos chip”, ? j. microelectromechanical systems, vol. 15, no. 4, aug. 2006, pp. 879 - 889. pdf
lin wang, todd r. christenson, yohannes m. desta, rainer k. fettig, jost goettert ,
high - resolution x - ray masks for high aspect ratio microelectromechanical systems applications ,
j. micro / nanolith. mems moems 3 (3) (1 july 2004 )
t. liu, p. sen, and c. - j. kim, “characterization of nontoxic liquid - metal alloy galinstan? for applications in micro devices, ” journal of microelectromechanical systems, vol. 21, no. 2, april 2012, pp. 443 - 450. pdf
t. liu, p. sen, and c. - j. kim, “characterization of nontoxic liquid - metal alloy galinstan? for applications in micro devices, ” journal of microelectromechanical systems, vol. 21, no. 2, april 2012, pp. 443 - 450. pdf
hur j. i. , meng d. d. , kim c. - j. “self - pumping membraneless miniature fuel cell with an air - breathing, fuel - tolerant pt cathode. ” journal of microelectromechanical systems. vol. 21, 2012, pp. 476 - 483 .
j. li and c. - j. kim, “development of handheld digital microfluidic systems, ” proc. int. conf. miniaturized systems for chemistry and life sciences (mtas), gyeongju, korea, oct. 2015, pp. 1199 - 1201 .
- read on multiple operating systems and devices. easily read ebooks on smart phones, computers, or any ebook readers, including kindle .
msc micro and nanotechnology is a one year masters degree with a focus on microelectromechanical systems (mems) and nanoelectronics. you will develop knowledge and understanding of the microtechnology and nanotechnology aspects of electronic engineering and their application in micro and nanoscale devices. specialist options also support study for the biomedical and bionanotechnology industries .
…communications application for nanotechnology is microelectromechanical systems (mems), devices sized at the micrometre level (millionths of a metre). mems are currently poised to have a major impact on communications via optical switching. in the future, electromechanical devices may shrink to nanodimensions to take advantage of the higher frequencies of mechanical…
mayer, thomas m. , de boer, maarten p. , shinn, neal d. , clews, peggy j. , & michalske, terry a. chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems. united states. doi: 10. 1116 / 1. 1288200 .
pramanick, b. , martinez - chapa, s. o. , madou, m. , hwang, h. fabrication of 3d carbon microelectromechanical systems (c - mems). j. vis. exp. (124), e55649, doi: 10. 3791 / 55649 (2017) .
plasma etch, inc. has a history of working with the microelectromechanical systems industry. we have worked with accelerometer, roll - over sensor, and air bag deployment sensor manufacturers in the automotive industry. we are committed to providing unparalleled plasma treatment solutions for every possible application. some of these applications include :
nanofabrication encompasses diverse fields such as; nanophotonic and solid state circuits, microelectromechanical systems, and microfluidic systems. the elionix electron beam lithography (ebl) tools are known for ultra - high precision to fabricate small nano - structures, excellent reliability, small footprint, and low cost of ownership. since 1975, elionix has made significant contributions in the fields of fine processing, and measurement and analysis. the elionix corporate philosophy is that of two css; challenge and speed, and customer satisfaction. to date, elionix has sold over 350 ebl systems to research institutes and industrial customers worldwide .
we have previously presented a microelectromechanical systems (mems) viscometric sensor for continuous glucose monitoring. the sensing fluid used therein was based on protein concanavalin a, which is known to have significant drawbacks, such as immunotoxicity and instability. to address this issue, a stable, biocompatible polymeric sensing fluid has been developed .
g. y. sun, x. zhao, and c. - j. kim, “fabrication of very - high - aspect - ratio microstructures in complex patterns by photoelectrochemical etching”, journal of microelectromechanical systems, vol. 21, no. 6, dec. 2012, pp. 1504 - 1512. pdf
s. k. cho, h. moon, and c. - j kim, “creating, transporting, cutting, and merging liquid droplets by electrowetting - based actuation for digital microfluidic circuits”, j. microelectromechanical systems, vol. 12, no. 1, february 2003, pp. 70 - 80 .
g. y. sun, x. zhao, and c. - j. kim, “fabrication of very - high - aspect - ratio microstructures in complex patterns by photoelectrochemical etching”, journal of microelectromechanical systems, vol. 21, no. 6, dec. 2012, pp. 1504 - 1512. pdf
pi' s q - 521 and q - 522 sub - miniature precision stages? can be assembled to form extremely small xyz positioning systems .
the 19th international conference on miniaturized systems for chemistry and life sciences, microtas 2015. october 25 - 29, 2015. gyeongju, korea .
this paper studies analytically and numerically the spring softening and hardening phenomena that occur in electrostatically actuated microelectromechanical systems comb drive resonators utilizing folded suspension beams. an analytical expression for the electrostatic force generated between the combs of the rotor and the stator is derived and takes into account both the transverse and longitudina... view full abstract»
parikh, dhara, barry craver, hatem nounu, fu - on fong, and j. c. wolfe ,
nanoscale pattern definition on non - planar surfaces using ion beam proximity lithography and conformal, plasma - deposited resist ,
journ. microelectromechanical systems, vol. 17, 735 - 740, june 2008 .
sun j. , hur i. , zhao x. , kim c. - j. “fabrication of very - high - aspect ratio micro metal posts and gratings by photo - electrochemical etching and electroplating. ” journal of microelectromechanical systems. vol 20, no. 4. august 2011. pp. 876 - 884 .
contributions to this topic should address the fabrication of new micro / nano structures, new fabrication approaches to existing devices or the integration of structures and devices into new smart systems. the emphasis in this topic should be given to the integration of processes and technologies to build devices or systems with added functionality .
mayer, thomas m. , de boer, maarten p. , shinn, neal d. , clews, peggy j. , and michalske, terry a. wed .
chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems
. united states. doi: 10. 1116 / 1. 1288200. urltoken
lee y - i et al :
dry release for surface micromachining with hf vapor - phase etching
journal of microelectromechanical systems, us, ieee inc. new york, vol. 6, no. 3, 1 september 1997 (1997 - 09 - 01), pages 226 - 232, xp000727189 issn: 1057 - 7157
j. i. hur, d. d. meng, and c. - j. kim, “self - pumping membraneless miniature fuel cell with an air - breathing, fuel - tolerant pt cathode, ” journal of microelectromechanical systems, vol. 21, no. 2, april 2012, pp. 476 - 483. pdf
j. i. hur, d. d. meng, and c. - j. kim, “self - pumping membraneless miniature fuel cell with an air - breathing, fuel - tolerant pt cathode, ” journal of microelectromechanical systems, vol. 21, no. 2, april 2012, pp. 476 - 483. pdf
mems sales in both fiber - optics equipment and wireless systems, including next generation cell phones, will be the major market drivers in the telecom industry .
1. a microfabrication process for fabricating a microelectromechanical systems device, comprising: depositing one or a stack of layers on a substrate; patterning said one or a stack of layers; depositing a middle layer on said one or a stack of layers; and patterning the middle layer using said one or a stack of layers as a photomask .
plasma etchers are available in a variety of sizes. industrial large chamber plasma systems can be as large as 12, 600 liters (approximately 3, 333 gallons). these systems are custom built to meet unique challenges of large scale plasma processing. other plasma systems convey parts on a tray that doubles as the plasma chamber floor. parts to be processed are conveyed to the plasma chamber, raised into it, treated, lowered and conveyed to the next step .
in the late 1980s, the design and manufacturing tool set developed for vlsi was adapted for use in a field called microelectromechanical systems (mems). these systems interface with both electronic and nonelectronic signals and interact with the nonelectrical physical world as well as the electronic world by merging signal processing with sensing and / or actuation. instead of handling only electrical signals, mems also bring into play mechanical elements, some with moving parts, making possible systems such as miniature fluid - pressure and flow sensors, accelerometers, gyroscopes, and micro - optical devices. mems are designed using computer - aided design (cad) techniques based on vlsi and mechanical cad systems and are typically batch - fabricated using vlsi - based fabrication tools. like ics, mems are progressing toward smaller sizes, higher speeds, and greater functionality .
contributions to this topic should address biological problems and show how micro / nano engineering can provide with the appropriate solution, starting from biomaterials, technological processes, algorithms, biomimetics, microelectromechanical systems for biological sensing (biomems) or, in general, any kind of development that results in an advance in biology and medicine. targeted areas can be :
long and hollow glassy carbon microfibers were fabricated based on the pyrolysis of a natural product, human hair. the two fabrication steps of carbon microelectromechanical and carbon nanoelectromechanical systems, or c - mems and c - nems, are: (i) photolithography of a carbon - rich polymer precursor and (ii) pyrolysis of the patterned polymer precursor .
object of the present invention is to provide an improved process for producing of microelectromechanical systems. another object of the present invention is to provide novel etching gas mixtures suitable, la. , for application in the process of the present invention. these and other objects of the present invention are achieved by the process and gas mixtures as outlined below .
d. d. meng, t. cubaud, c. - m. ho and c. - j. kim, “a methanol - tolerant, gas - venting microchannel for a micro direct methanol fuel cell”, j. microelectromechanical systems, vol. 16, no. 6, dec. 2007, pp. 1403 - 1410. pdf
g. sun, h. park, and c. - j. kim, “development of a miniature shear sensor for direct comparison of skin - friction drags”, journal of microelectromechanical systems, vol. 24, no. 5, october 2015, pp. 1426 - 1435. (doi: 10. 1109 / jmems. 2015. 2409475 )
f. chamran, y. yeh, h. - s. min, b. dunn, and c. - j. kim, “fabrication of high - aspect - ratio electrode arrays for three - dimensional microbatteries”, j. microelectromechanical systems, vol. 16, no. 4, aug. 2007, pp. 844 - 851. pdf
extension of microelectromechanical systems (mems) into more extreme operating conditions will require a wider range of material properties than are currently available in conventional systems. successful integration of new materials is dependent on concurrent development of compatible fabrication routes and scale appropriate evaluation techniques. this review focuses on emerging material classes that have potential to replace silicon - based mems in elevated temperature applications. basic silicon mechanical properties and micromachining methods are reviewed to provide context for developing material systems such as silicon carbide, silicon carbonitrides, and several nickel - based alloys. potential improvements in strength, thermal stability, and reliability are juxtaposed with fabrication, reproducibility, and economic feasibility issues that must also be addressed .
mayer, thomas m. , de boer, maarten p. , shinn, neal d. , clews, peggy j. , and michalske, terry a. chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems. united states: n. p. , 2000. web. doi: 10. 1116 / 1. 1288200 .
n2 - extension of microelectromechanical systems (mems) into more extreme operating conditions will require a wider range of material properties than are currently available in conventional systems. successful integration of new materials is dependent on concurrent development of compatible fabrication routes and scale appropriate evaluation techniques. this review focuses on emerging material classes that have potential to replace silicon - based mems in elevated temperature applications. basic silicon mechanical properties and micromachining methods are reviewed to provide context for developing material systems such as silicon carbide, silicon carbonitrides, and several nickel - based alloys. potential improvements in strength, thermal stability, and reliability are juxtaposed with fabrication, reproducibility, and economic feasibility issues that must also be addressed .
ab - extension of microelectromechanical systems (mems) into more extreme operating conditions will require a wider range of material properties than are currently available in conventional systems. successful integration of new materials is dependent on concurrent development of compatible fabrication routes and scale appropriate evaluation techniques. this review focuses on emerging material classes that have potential to replace silicon - based mems in elevated temperature applications. basic silicon mechanical properties and micromachining methods are reviewed to provide context for developing material systems such as silicon carbide, silicon carbonitrides, and several nickel - based alloys. potential improvements in strength, thermal stability, and reliability are juxtaposed with fabrication, reproducibility, and economic feasibility issues that must also be addressed .
g. sun, j. i. hur, x. zhao, and c. - j. kim, “fabrication of very - high - aspect - ratio micro metal posts and gratings by photo - electrochemical etching and electroplating, ” journal of microelectromechanical systems, vol. 20, no. 4, august 2011, pp. 876 - 884. pdf
f. - g. tseng, c. - j. kim, and c. - m. ho, “a high resolution high frequency monolithic top - shooting microinjector free of satellite drops: part i, concept, design and model”, j. microelectromechanical systems, vol. 11, no. 5, october 2002, pp. 427 - 436 .
k. - s. yun, i. - j. cho, j. - u. bu, c. - j. kim, and e. yoon “a surface - tension driven micropump for low voltage and low power operations”, j. microelectromechanical systems, vol. 11, no. 5, october 2002, pp. 454 - 461 .
j. j. - y. gill, l. v. ngo, p. r. nelson, and c. - j. kim, “elimination of extra spring effect at the step - up anchor of surface - micromachined structure”, j. microelectromechanical systems, vol. 7, no. 1, march 1998, pp. 114 - 121 .
f. - g. tseng, c. - j. kim, and c. - m. ho, “a high resolution high frequency monolithic top - shooting microinjector free of satellite drops: part ii: fabrication, implementation, and characterization”, j. microelectromechanical systems, vol. 11, no. 5, october 2002, pp. 437 - 447 .
l. latorre, j. kim, j. lee, p. - p. de guzman, h. j. lee, p. nouet, and c. - j. kim, “electrostatic actuation of microscale liquid - metal droplets”, j. microelectromechanical systems, vol. 11, no. 4, august 2002, pp. 302 - 308 .
abstract =
extension of microelectromechanical systems (mems) into more extreme operating conditions will require a wider range of material properties than are currently available in conventional systems. successful integration of new materials is dependent on concurrent development of compatible fabrication routes and scale appropriate evaluation techniques. this review focuses on emerging material classes that have potential to replace silicon - based mems in elevated temperature applications. basic silicon mechanical properties and micromachining methods are reviewed to provide context for developing material systems such as silicon carbide, silicon carbonitrides, and several nickel - based alloys. potential improvements in strength, thermal stability, and reliability are juxtaposed with fabrication, reproducibility, and economic feasibility issues that must also be addressed .
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samples of 53 materials that are used or potentially can be used or in the fabrication of microelectromechanical systems and integrated circuits were prepared: single - crystal silicon with two doping levels, polycrystalline silicon with two doping levels, polycrystalline germanium, polycrystalline sige, graphite, fused quartz, pyrex 7740, nine other preparations of silicon dioxide, four preparation... view full abstract»
yang, e. - h. hishinuma, y. cheng, j. - g. trolier - mckinstry, s. bloemhof, e. and levine, b. m. 2006. thin - film piezoelectric unimorph actuator - based deformable mirror with a transferred silicon membrane. journal of microelectromechanical systems, vol. 15, issue. 5, p. 1214 .
j. ok, y. - w. lu, and c. - j. kim, “pneumatically driven microcage for microbe manipulation in a biological liquid environment”, j. microelectromechanical systems, 2006, vol. 15, no. 6, dec. 2006, pp. 1499 - 1505. (doi: 10. 1109 / jmems. 2006. 883887) pdf
used for thermal energy harvesting, thermoelectric generator (teg) can convert heat into electricity directly. structurally, the main part of teg is the thermopile, which consists of thermocouples connected in series electrically and in parallel thermally. benefiting from massive progress achieved in a microelectromechanical systems technology, micro teg (μ - teg) with advantages of small vol... view full abstract»
j. ok, y. - w. lu, and c. - j. kim, “pneumatically driven microcage for microbe manipulation in a biological liquid environment”, ? j. microelectromechanical systems, 2006, vol. 15, no. 6, dec. 2006, pp. 1499 - 1505. (doi: 10. 1109 / jmems. 2006. 883887) pdf
established 40 years ago, elionix manufactures systems that utilize particle beams; electron, ion and electromagnetic waves that include light and x - ray. over the years, elionix has manufactured more than 350 dedicated electron beam lithography systems and maintains the largest market share in japan, which is widely known for world - class electron beam design and development .
resonators fabricated in heavily doped silicon have been noted to have a reduced frequency - temperature dependence compared with lightly doped silicon. the resonant frequency of silicon microelectromechanical systems (mems) resonators is largely governed by the material' s elastic properties, which are known to depend on doping. in this paper, a suite of different types and orientations of resonator... view full abstract»
[ 5 ] releasing microelectromechanical systems and device sensor and actuator devices to form free - hanging structures via wet etching method usually leads to problems such as stiction or adhesion, a condition where the substrate and the microstructures adhere together causing the microelectromechanical systems and device to fail. adhesion can occur during processing when the suspended structure is exposed to an aqueous rinsing and drying cycle. strong attractive capillary forces can develop during the dehydration process due to the very small gap of the device - to - substrate, causing it to collapse and subsequently pinned to the substrate. separating the two surfaces is often complicated due to the fragile nature of the microstructure. this type of device failure develops both in fabrication and during device operation, being a dominant source of yield loss in mems .
cantilever - type all - organic microelectromechanical systems based on molecularly imprinted polymers for specific analyte recognition are used as chemical sensors. they are produced by a simple spray - coating - shadow - masking process. analyte binding to the cantilever generates a measurable change in its resonance frequency. this allows label - free detection by direct mass sensing of low - molecular - weight analytes at nanomolar concentrations .
the young' s modulus (e) of a material is a key parameter for mechanical engineering design. silicon, the most common single material used in microelectromechanical systems (mems), is an anisotropic crystalline material whose material properties depend on orientation relative to the crystal lattice. this fact means that the correct value of e for analyzing two different designs in sil... view full abstract»
located in livermore, california, yield engineering systems (yes) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers .
microelectromechanical systems (mems) provide engineers with a rich palette of technical solutions to a wide range of actuation and sensing challenges. mems devices are low cost, easily integrated with sense and drive electronics, are robust, and can be designed to respond to electrical, mechanical, or chemical stimuli. because they are mechanical, mems devices suffer from being relatively slow in... view full abstract»
this paper describes the design and fabrication of an electrostatic microelectromechanical systems (mems) switch that can be co - fabricated on the same substrate with a capacitive micromachined ultrasonic transducer (cmut) as a transmit / receive switch. the structure of the switch is modified from a single cmut cell. an interrupted transmission line is defined across the center of the cell with cont... view full abstract»
a microelectromechanical systems (mems) capacitive - type passive wireless pressure sensor designed to operate in harsh environments at temperatures up to 1000 °c is presented. the pressure sensor has a sapphire - based diaphragm and structural body, and a platinum - based capacitive element. the capacitive element is configured as a part of a slot patch antenna that is designed to operate in a f... view full abstract»
g. sun, t. liu, p. sen, w. shen, c. gudeman and c. - j. kim, “electrostatic side - drive rotary stage on liquid - ring bearing, ” journal of microelectromechanical systems, vol. 23, no. 1, feb. 2014, pp. 147 - 156. (doi: 10. 1109 / jmems. 2013. 2262592 )
the paper presents the first tool for the emulation of microelectromechanical systems (memss) to be used for the characterization of electronics designed for mems. with such a tool, electronics of different nature (integrated, discrete - component, and instrumentation) can be tested (debugged) as in operation, even in the absence of physically available mems transducers. the proposed mems emulator (... view full abstract»
systems [ 14, 15 ], mass analyzers [ 16 - 21 ], detectors [ 22 - 26 ], and vacuum components [ 27 - 30 ]. the mems fabrication process
micro electromechanical systems (mems) are miniaturized devices combining electrical and mechanical elements, and are made using microfabrication techniques. mems devices are capable of sensing and interacting with their surrounding environment .
we have designed a novel microelectromechanical systems (mems) resonant acoustic wake - up switch which is actuated by ambient sound waves, using zero power while waiting for a signal at its resonant frequency and less than 10 nw when the signal is detected. the system uses a battery to charge a capacitor through mems switches activated only by the target signals. the sensor is of rotational design... view full abstract»
this paper reports theoretical analysis and experimental results on a new class of rectangular plate and ring - shaped contour - mode piezoelectric aluminum nitride radio - frequency microelectromechanical systems resonators that span a frequency range from 19 to 656 mhz showing high - quality factors in air (qmax = 4300 at 229. 9 mhz), low motional resistance (ranging from 50 to 700 omega), and c... view full abstract»
rie etching is used extensively in the semi - conductor and microelectromechanical systems (mems) industries. for example, in the manufacturing of printed circuit boards (pcbs), anisotropic etching is used to form circuit patterns in wafers. reactive plasma etching rates vary greatly depending on the rie etch plasma system and substrate being plasma etched. rie etch rates range from 0. 001 micrometer / minute to 1 micrometer / min .
the rie - 800ipb is a dedicated silicon etching system specifically designed for the bosch process (licensed from robert bosch gmbh). the systems' unique reaction chamber, electrode, stage and vacuum design overcomes the problems encountered in competing systems to allow high rate (~ 50 μm / min), tilt free, high aspect etching with industry leading selectivity (~ 250: 1) .
microelectromechanical systems have great potentials to revolutionize all areas of science and technology by creating sophisticated miniature devices. the basis of the microelectromechanical systems fabrication is today' s silicon processing technology mostly based on optical lithography and wet or dry etching processes. the optical limitation of such lithographic techniques will eventually force the semiconductor industry to adapt new ways of processing ever smaller structures. since eigler and coworkers have shown that a scanning microscope tip can be used to manipulate single atoms, creation of nanoscale structures with scanning probe microscopes (spm) has been a popular subject of study. however, compared to the optical lithography, the processing speed of spm is too slow for implementation in actual device construction. there have been some efforts to construct parallel processing spm devices with multi - tip cantilevers. most of these are delicate devices based on atomic force microscopes (afms) .
1. a method of producing a microelectromechanical system (
mems
) from a structure comprising a step wherein the structure is etched applying an etching gas comprising elemental fluorine or carbonyl fluoride (cof2) or a mixture of both .
the etch rates for 317 combinations of 16 materials (single - crystal silicon, doped, and undoped polysilicon, several types of silicon dioxide, stoichiometric and silicon - rich silicon nitride, aluminum, tungsten, titanium, ti / w alloy, and two brands of positive photoresist) used in the fabrication of microelectromechanical systems and integrated circuits in 28 wet, plasma, and plasmaless - gas - phase... view full abstract»
products in the medical industry require a diversity of surfaces from molecular specific bonding sites for dna microarrays to enhanced biocompatible surfaces for medical devices. products as diverse microelectromechanical systems (mems) also require hydrophobic surfaces to minimize stiction. as technology advances, the need for precise and reproducible control over nanoscale surface areas increases. while rf plasma can modify surface energies, the coating of functionally diverse organosilanes provides the ability for precise surface modification .
y. - i. lee, k. - h. park, j. lee, c. - s. lee, h. j. yoo, c. - j. kim, and y. - s. yoon, “dry release for surface micromachining with hf vapor - phase etching”, j. microelectromechanical systems, vol. 6, no. 3, sept. 1997, pp. 226 - 233 .
sandia designs, characterizes and delivers miniaturized, reliable rf mems components and systems such as filters, switches, and oscillators that provide differentiating capabilities to sandia system groups impacting national security and nuclear weapons .
mems promise to revolutionize nearly every product category by bringing together silicon - based microelectronics fabrication with silicon micromachining technology, thereby, making possible the realizing of complete systems - on - a - chip .
for over 30 years, yield engineering systems, inc. (yes) has designed and manufactured quality process equipment to assist in the successful development of products in industries such as biotechnology and mems .
recent decades have seen rapid development in the manufacture of microelectromechanical systems (mems) at the micrometer scale, mostly based on silicon wafer processing techniques, with characteristic length scales of millimeters to nanometers. however, standard mems techniques are often inappropriate for producing machines with complex 3d topologies and varied constituent materials at the mesoscale, at sizes between micrometer scales of mems and centimeter scales of larger devices that can be manufactured with more traditional methods .
surface micromachining of a microelectromechanical systems (mems) structure fundamentally involves the deposition and patterning of at least two types of layers on top of a substrate. the first type of layer includes one or more structural layers in which the final mems structure is formed. the second type of layer includes sacrificial layers which support or encase the mems structure during formation of the mems and which is subsequently dissolved away resulting in a released mems structure .
plasma etching is used extensively in the semi - conductor and microelectromechanical systems (mems) industries. for example, in the manufacturing of printed circuit boards (pcbs), isotropic etching is used to plasma clean circuits after machining (a process termed desmearing) and prior to electroplating. anisotropic etching is used to form circuit patterns in wafers. the anisotropic plasma etching in this application is highly energetic and called reactive ion etching (rie) .
a 4 - terminal microelectromechanical systems (mems) relay has long been sought for signal switching applications because it allows de - coupling of the actuation (body and gate) and signal (source and drain) components unlike a 3 - terminal mems relay. however, the contact resistance still remains a serious problem in current 4 - terminal mems relays compared with the 3 - terminal mems relays. in this pape... view full abstract»
electrostatic discharge (esd) and electrical overstress (eos) damage of micro - electrical - mechanical systems (mems) has been identified as a new failure mode. this failure mode has not been previously recognized or addressed primarily due to the mechanical nature and functionality of these systems, as well as the physical failure signature that resembles stiction. because many mems devices... [ show full abstract ]
our new techniques allow us to use any material including polymers, metals, ceramics, and composites. along with integrated electronics, this means that we can generate full systems in any three - dimensional shape .
elemental fluorine and carbonyl fluoride are suitable etchants for producing microelectromechanical devices (' mems'). they are preferably applied as mixtures with nitrogen and argon. if applied in bosch - type process, c 4 f 6 is a highly suitable passivating gas .
mems already have a track record of commercial success that provides a compelling case for further development (e. g. , pressure - sensing, acceleration sensing, and ink - jet printing). like any developing field, however, commercial successes in the mems field coexist with products still under development that have not yet established a large customer base (e. g. , mems display systems and integrated chemical - analysis systems) .
j. lee and c. - j. kim, “liquid micromotor driven by continuous electrowetting”, proc. ieee micro electro mechanical systems workshop, heidelberg, germany, jan. 1998, pp. 538 - 543 .
radauscher, e. j. , parker, c. b. , gilchrist, k. , di dona, s. , russell, z. e. , hall, s. ,... amsden, j. j. (2016). a miniature electron ionization source fabricated using microelectromechanical systems (mems) with integrated carbon nanotube (cnt) field emission cathodes and low - temperature co - fired ceramics (ltc. international journal of mass spectrometry, urltoken .
this programme outlines the micro and nanotechnology aspects of electronic engineering, with a focus on microelectromechanical systems and nanoelectronics. these technologies, for example, underpin research and development of miniaturised sensors, including the motion and position sensors in mobile phones, and of nanoscale logic and memory devices for next - generation consumer electronics and future quantum devices. the programme also addresses microfluidic technology, enabling miniaturised biodevices for point - of - care diagnostic applications, and covers the fundamentals of photonic circuits and devices .
many of the mems developed by principal research scientist luis fernando velásquez - garcía — from thrusters for tiny satellites to systems for spinning out flexible functional materials — involve dense arrays of tiny semiconductor tips, like those shown here .
b. shivkumar and c. - j. kim, “microriveting - a new wafer joining method”, proc. ieee micro electro mechanical systems workshop, nagoya, japan, jan. 1997, pp. 197 - 202 .
we report a miniature adjustable multi - blade iris diaphragm driven by microelectromechanical - systems - based electrostatic rotary microactuators. a proof - of - concept device is designed and fabricated using a silicon - on - insulator micromachining process. the diameter of the developed iris diaphragm aperture is experimentally demonstrated to be able to adjust from 0. 45 to 1. 56 mm. when used in a miniature camera lens system, the current prototype device is capable of providing an adjustment range of more than three full
... mono - crystalline silicon with (100) plane as the major surface is the most commonly used semiconductor substrate material for the production of microchips. the single crystal silicon is not only a dominant substrate material for the fabrication of micro - electro and micro - mechanical components such as microelectromechanical - systems (mems) but also an important infrared optical material wang et al. [ 2 ]. sometimes ic chips need to have pockets machined on them for failure analysis... .
damages are created in a sacrificial layer of silicon dioxide by ion implantation to enhance the etch rate of silicon - dioxide in liquid and vapor phase hydrofluoric acid. the etch rate ratio between implanted and unimplanted silicon dioxide is more than 150 in vapor hydrofluoric acid (vhf). this feature is of interest to greatly reduce the underetch of microelectromechanical systems anchors. based on the experimentally extracted etch rate of unimplanted and implanted silicon dioxide, the patterning of the sacrificial layer can be predicted by simulation .
s. k. cho and c. - j. kim, “particle separation and concentration control for digital microfluidic systems”, proc. ieee conf. mems, kyoto, japan, january 2003, pp. 686 - 689 .
lead zirconate titanate (pzt) films are very attractive for microelectromechanical systems (mems) applications because of their high piezoelectric coefficients and good electromechanical coupling. in this work, wet - etch patterning of sol - gel pzt films for mems applications, typically with film thicknesses ranging from 2 to 10 microns, was studied. a two - step wet - etch process was developed. in the first step, 10: 1 buffered hf is used to remove the majority of the film at room temperature. then a solution of 2hcl: h
john y. kim and c. - j. kim, “comparative study of various release methods for polysilicon surface micromachining”, proc. ieee micro electro mechanical systems workshop, nagoya, japan, jan. 1997, pp. 442 - 447 .
jacob white, the cecil h. green professor of electrical engineering and computer science, develops computer - aided design (cad) tools for engineering applications. these days, his academic research focuses more on biological and biomedical devices, but in the past, he’s worked on cad systems for mems as well. modern cad systems — white’s included — don’t just provide intuitive visual interfaces for device design; they also include simulation software that verifies the devices’ performance, a process known as computational prototyping .
sandia designs, develops, builds and delivers highly sensitive, reliable micro and nano - scale optical solutions across electromechanical and biological domains for physical sensing and optical signal processing in national security applications. sandia uses microfabrication techniques to create novel approaches and methodologies for micro - and nano - scale optical sensing and control. sandia utilizes these approaches alongside proven opto - electro - mechanical techniques to push performance limits in displacement and acceleration sensing, optical wavefront control and beam shaping. these capabilities are applied with system level input to build high performance, reliable, integrated systems such as inertial and acoustic sensors, high speed optical switches and modulators, adaptive optics systems, micro - spectrometers, integrated optical circuits and on - chip fluorescence - based sensors for microfluidic systems .
besides deep silicon etching, corial also innovates by developing processes and systems to serve the latest customer needs, such as deep etching of hard materials like glass or sapphire, thick sio2 film deposition for hard mask applications, and etching of piezoelectric films .
13. a method for fabricating a microelectromechanical systems device, the method of comprising: a) depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; b) patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; c) depositing a photosensitive layer over said one or a stack of layers; and d) passing light through said at least one aperture to expose said photosensitive layer.
microelectromechanical systems ( mems , also written as micro-electro-mechanical , microelectromechanical or microelectronic and microelectromechanical systems and the related micromechatronics ) is the technology of microscopic devices , particularly those with moving parts . it merges at the nano-scale into nanoelectromechanical systems ( nems ) and nanotechnology . mems are also referred to as micromachines in japan , or micro systems technology ( mst ) in europe . mems are made up of components between 1 and 100 micrometres in size ( i.e. 0.001 to 0.1 mm ) , and mems devices generally range in size from 20 micrometres to a millimetre ( i.e. 0.02 to 1.0 mm ) , although components arranged in arrays ( e.g. , digital micromirror devices ) can be more than 1000 mm ² . they usually consist of a central unit that processes data ( the microprocessor ) and several components that interact with the surroundings such as microsensors . because of the large surface area to volume ratio of mems , forces produced by ambient electromagnetism ( e.g. , electrostatic charges and magnetic moments ) , and fluid dynamics ( e.g. , surface tension and viscosity ) are more important design considerations than with larger scale mechanical devices . mems technology is distinguished from molecular nanotechnology or molecular electronics in that the latter must also consider surface chemistry . the potential of very small machines was appreciated before the technology existed that could make them ( see , for example , richard feynman 's famous 1959 lecture there 's plenty of room at the bottom ) . mems became practical once they could be fabricated using modified semiconductor device fabrication technologies , normally used to make electronics . these include molding and plating , wet etching ( koh , tmah ) and dry etching ( rie and drie ) , electro discharge machining ( edm ) , and other technologies capable of manufacturing small devices . an early example of a mems device is the resonistor – an electromechanical monolithic resonator . 
microelectromechanical systems (mems, also written as micro-electro-mechanical, microelectromechanical or microelectronic and microelectromechanical systems and the related micromechatronics) is the technology of microscopic devices, particularly those with moving parts. it merges at the nano-scale into nanoelectromechanical systems (nems) and nanotechnology. mems are also referred to as micromachines in japan, or micro systems technology (mst) in europe. mems are made up of components between 1 and 100 micrometres in size (i.e. 0.001 to 0.1 mm), and mems devices generally range in size from 20 micrometres to a millimetre (i.e. 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm ². they usually consist of a central unit that processes data (the microprocessor) and several components that interact with the surroundings such as microsensors. because of the large surface area to volume ratio of mems, forces produced by ambient electromagnetism (e.g., electrostatic charges and magnetic moments), and fluid dynamics (e.g., surface tension and viscosity) are more important design considerations than with larger scale mechanical devices. mems technology is distinguished from molecular nanotechnology or molecular electronics in that the latter must also consider surface chemistry. the potential of very small machines was appreciated before the technology existed that could make them (see, for example, richard feynman's famous 1959 lecture there's plenty of room at the bottom). mems became practical once they could be fabricated using modified semiconductor device fabrication technologies, normally used to make electronics. these include molding and plating, wet etching (koh, tmah) and dry etching (rie and drie), electro discharge machining (edm), and other technologies capable of manufacturing small devices. an early example of a mems device is the resonistor – an electromechanical monolithic resonator.
microelectromechanical systems (mems, also written as micro-electro-mechanical, microelectromechanical or microelectronic and microelectromechanical systems and the related micromechatronics) is the technology of microscopic devices, particularly those with moving parts. it merges at the nano-scale into nanoelectromechanical systems (nems) and nanotechnology. mems are also referred to as micromachines in japan, or micro systems technology (mst) in europe. mems are made up of components between 1 and 100 micrometres in size (i.e. 0.001 to 0.1 mm), and mems devices generally range in size from 20 micrometres to a millimetre (i.e. 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm ². they usually consist of a central unit that processes data (the microprocessor) and several components that interact with the surroundings such as microsensors. because of the large surface area to volume ratio of mems, forces produced by ambient electromagnetism (e.g., electrostatic charges and magnetic moments), and fluid dynamics (e.g., surface tension and viscosity) are more important design considerations than with larger scale mechanical devices. mems technology is distinguished from molecular nanotechnology or molecular electronics in that the latter must also consider surface chemistry. the potential of very small machines was appreciated before the technology existed that could make them (see, for example, richard feynman's famous 1959 lecture there's plenty of room at the bottom). mems became practical once they could be fabricated using modified semiconductor device fabrication technologies, normally used to make electronics. these include molding and plating, wet etching (koh, tmah) and dry etching (rie and drie), electro discharge machining (edm), and other technologies capable of manufacturing small devices. an early example of a mems device is the resonistor – an electromechanical monolithic resonator.