upilex
table 1 summarizes the typical properties of the upilex - s and upilex - sn polyimide films .
- s
, with superior mechanical properties. dimensional stability and chemical resistance are equal to
upilex
at high temperatures attention should be paid to ventilation. this is because dmac, which
upilex
upilex vt is a heat bonding type of polyimide film without using adhesive and applicable with various substrate material .
upilex - s demonstrates outstanding mechanical characteristics through a wide temperature range. upilex - s displays high tensile strength and modulus, and also features outstanding long - term heat resistance. another advantage inherent in upilex - s is its high resistance to hydrolysis, as its properties are practically unaffected, even by immersion in boiling water for long periods of time .
- s
exhibits excellent electrical characteristics over a wide range of temperatures and frequencies. even at high temperatures ,
upilex
it is suitable for sputtering or plating process and has superior mechanical properties. dimensional stability and chemical resistance are equal to
upilex
the tensile modulus of upilex - s polyimide films is 9121mpa, which is more than double the value of an earlier version of the product. the tensile strength of this material is 520mpa. the upilex - s polyimide film experiences very little degradation in these properties at elevated temperatures, making it suitable for use in extreme temperature applications. the dimensional stability of the upilex - s polyimide film is much better than other competitive products .
the thermal resistance of the upilex - s polyimide film is much higher than any other currently available plastic films. the very small thermal linear expansion coefficients and heat shrinkage values of the upilex - s polyimide film enable using the material in fpc and tab - tape substrates containing minute circuits .
high heat resistance upilex s can be used in high - temperature processes just below 500°c. this exceeds industry standard operating temperatures around 300°c. high mechanical properties upilex has excellent wear resistance and toughness. this allows use of thinner films in applications where strength is critical. chemical resistance it has excellent chemical resistance to organic solvents, gasoline, automotive oil, alkalis, acids etc. . high - performance technology the industry leading surface uniformity and smoothness of upilex improves performance and adds value to your application .
description: upilex, the ultra - high heat - resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (bpda), of which process ube industries originally developed, and diamine. most notable of these characteristics is upilex' s physical, mechanical, electrical, and chemical properties under high - temperature conditions .
- s
delivers outstanding mechanical characteristics across a wide temperature range. it also demonstrates high tensile strength and modulus, and even features outstanding long - term heat resistance. another exceptional feature of
upilex
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this material shows good resistance to virtually all chemicals, including alkali and inorganic acid solutions, and is insoluble in all types of organic solvent. there is no change in the dimensional stability and physical properties of the upilex - s polyimide film even when subjected to chemical exposure. as a result of its good chemical resistance, the upilex - s is suitable as release film, even without a release agent .
upilex ® - foam is a new type of polyimide form that has been developed by our original technology of polyimide process. polyimide originally has the highest heat resistance in engineering plastics. upilex - foam is produced from polyimide in the process of our own, making the best use of the feature of polyimide. it shows improved properties over a wide range of environmental conditions, compared to the conventional polyimide foam. upilex - foam is applicable to a variety of use such as thermal, acoustic and mechanical vibration insulation, and weight saving for transportation systems such as aerospace vehicles, ships and automobiles, and for electric devices .
since outgassing is very low compared to general polyimide, it is the perfect film for many applications with vacuum and / or high - temperature processing. and, resin coats formed from a carrier base of
upilex
- s
is insoluble in all organic solvents and is sufficiently resistant to virtually all chemicals, including inorganic acid and alkali solutions. this chemical resistance provides exceptional physical properties as well as superior dimensional stability when
upilex
ube offers upilex - s polyimide films with fantastic resistance to heat and chemicals over a broad temperature range. they have a ul94 flammability rating of vtm - 0 and have no melting point. their mechanical properties are superior to other currently available products on the market .
- s
boasts the highest heat resistance of any plastic film currently available. its major features include a high starting temperature for thermal decomposition, smaller values for both heat shrinkage and thermal linear expansion coefficients, as well as flame resistance (ul94 vtm - 0). therefore ,
upilex
in addition, this polyimide film has very low hygroscopic expansion, heat shrinkage and linear expansion. besides having high tensile strength and modulus, the upilex - s polyimide film exhibits superior long - term heat resistance. its resistance to hydrolysis is very high as it virtually retains its properties even when immersed in boiling water for prolonged periods .
super - heat resistant polyimide film produced from ube' s exclusive
bpda (biphenyl tetracarboxylic dianhydride )
monomers. this formulation is unique to ube and exhibits outstanding dimensional stability, low water absorption and very high chemical resistance .
is used globally by many customers, who all demand the exceptional performance we deliver .
thermal properties: outstanding heat resistance. excellent heat shrinkage and dimensional stability. environmental resistance: low water absorption and hygroscopic expansion. chemical resistance: insoluble in all organic solvents and resistant to chemicals (acids and alkalis etc .). smooth surface: excellent surface smoothness allows fine pitch patterning .
molded articles have excellent heat resistance and chemical resistance, so they are used in insulation applications and in applications requiring environmental resistance .
as base films for laminated multilayer fpc and two - layer ccl, they have superior heat bonding characteristics and physical properties .
compared to other polyimide films, it has better surface smoothness and higher chemical resistance, greater stiffness and much higher heat resistance. outgassing is very low, so it is easy to use .
- s
is its high resistance to hydrolysis, as demonstrated by its properties being virtually unaffected even when it is immersed in boiling water for long periods of time .
- s
shows almost no deterioration in its electrical properties, unlike other plastic - type films. it also displays a low level of electrical insulation defects, making it an optimal choice for electrical and electronic uses that demand high reliability .
- s
changes little in size even when heated. this makes it ideal for use in fpc and tab - tape substrates composed of minute circuits .
- s
is exposed to chemicals. as resistance to various automotive oils (engine oil, brake oil, gasoline, etc .) is strong, it is suitable for use in many automotive applications .
- s
has a excellent smooth surface with low roughness. therefore, it can also be suitably used as a film carrier base for other high heat resistance resins, cushioning materials or releasing materials .
- s
have moderate adhesion strength to peel off later and offer a very smooth surface .
- rn
has many excellent physical characteristics, including molding process - ability and environmental resistance .
- rn
can be used in embossing, speaker diaphragms, aerospace applications, etc. .
- rn
has excellent tolerance not only to acids and organic solvents, but also to alkalis .
- rn
has excellent heat resistance, electrical properties, and radiation resistance .
since it has excellent elongation through heating and pressing, it is easy to make solid components using drawing process. molded articles have excellent strength characteristics .
- nvt
with metal (cu, sus, al) foil. in addition, they are also available for bonding films comprised of metal, ceramic and other materials .
- s
, with the addition of laminate workability in the heat press .
- s
, so it is suitable to use for flexible circuits and coverlay applications .
without any surface treatment, it offers excellent adhesive properties. additionally, the adhesive strength is enhanced by performing surface treatments, such as corona treatment .
it is suitable for sputtering or plating processes because of high surface adhesion. it offers a flexible base for high - performance electronic circuits .
in addition, it can also be used as an adhesive tape base material for loc packaging .
in sputtering or plating, a flexible base for electronic circuits that does not use any adhesives can be obtained .
generates pyrolytic products. ventilation should be adequate to ensure that concentrations of dmac and carbon monoxide are kept to safe levels (10ppm and 100ppm). ln addition, breathing safety equipment, such as organic gasmasks, should be used to prevent the inhalation of fumes .
the content provided is based on materials, data and information currently available and no guarantee is given with regard to content, physical properties or hazardous and harmful effects .
furthermore, handling precautions relate to normal handling. in unique situations requiring special handling, please use safety measures appropriate for the application and process .
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cte, linear, values determined by minute linear expansion tester at 5°c / min. temperature increments
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chemicals company, polyimide and specialty products div. polyimide business dept. polyimide business development gr .
thanks to innovation, ube’s most important skill, the company responds to the changes in society and their repercussions in industry. this drives the company, contributes to its development and has become ube’s identification as a creative industrial corporation .
this information has been sourced, reviewed and adapted from materials provided by ube industries .
hydrogenation is a chemical reaction between molecular hydrogen and other compounds and elements. hydrogenation is used in many applications such as the food industry, petrochemical industry and the pharmaceutical manufacturing industry .
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as part of the hübner photonics family of cobolt ab products, this company has recently released the revolutionary multi - line laser platform known as the cobolt skyra™. the cobolt skyra™ is expected to enable the next generation of compact and easy - to - use analytical instruments that will be used in the life science market .
cannon instrument company’s fully automated d155 density and specific gravity meter offers an affordable alternative to traditional manual hydrometer methods. it provides simple, one button operation with built - in thermal control to ensure fast, accurate measurement with 4 decimal resolution .
rheolaser coating allows a simple yet sensitive monitoring of microstructure evolution during a film formation process. in particular, the instrument precisely identifies open - time, touch - dry time, dry - hard time, and curing time .
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tml: total mass loss cvcm: collected volatile condensable materials wvr: water vapor regained.
upilex is a heat-resistant polyimide film formed from biphenyl tetracarboxylic dianhydride ( bpda ) monomers . its properties include dimensional stability , low water absorption and high chemical resistance . it was developed by ube industries . upilex-s , along with other polyimides kapton hn and kapton e , have been investigated by nasa with respect to their radiation durability for possible use in the next generation space telescope , where polymer film layer sunshields must operate at low temperatures and in the presence of cosmic rays . 
upilex is a heat-resistant polyimide film formed from biphenyl tetracarboxylic dianhydride (bpda) monomers. its properties include dimensional stability, low water absorption and high chemical resistance. it was developed by ube industries. upilex-s, along with other polyimides kapton hn and kapton e, have been investigated by nasa with respect to their radiation durability for possible use in the next generation space telescope, where polymer film layer sunshields must operate at low temperatures and in the presence of cosmic rays.
upilex is a heat-resistant polyimide film formed from biphenyl tetracarboxylic dianhydride (bpda) monomers. its properties include dimensional stability, low water absorption and high chemical resistance. it was developed by ube industries. upilex-s, along with other polyimides kapton hn and kapton e, have been investigated by nasa with respect to their radiation durability for possible use in the next generation space telescope, where polymer film layer sunshields must operate at low temperatures and in the presence of cosmic rays.