content: <PAGE>
   
                         SECURITIES AND EXCHANGE COMMISSION
                               Washington, D.C. 20549
  
                                      FORM 8-K
  
                 Current Report Pursuant to Section 13 or 15(d) of
                        The Securities Exchange Act of 1934
  
  
         Date of Report (date of earliest event reported):   March 13, 1997
  
  
                            ADVANCED MICRO DEVICES, INC.
                            ----------------------------
               (Exact name of registrant as specified in its charter)
  
  
  
               DELAWARE                    1-7882                   94-1692300
  -------------------------------       -----------            ------------------
  (State or other jurisdiction          (Commission            (I.R.S. Employer
        of incorporation)               File Number)           Identification No.)
   
  
         One AMD Place
         P.O. Box 3453
         Sunnyvale, California                                       94088-3453
  ---------------------------------------                            ----------
  (address of principal executive offices)                           (Zip Code)
  
  
  Registrant's telephone number,
   including area code:                                 (408) 732-2400
                                                         -------------
  
                                    Page 1 of 3
  <PAGE>
   
  Item 5.  Other Events.
  -------  -------------
  
         On March 13, 1997, Advanced Micro Devices, Inc. announced that AMD
  officials and bank syndicate representatives meeting in Dresden, Germany, signed
  a loan agreement which will finance Fab 30, a new semiconductor wafer
  fabrication factory and research center to be built by AMD.  The loan commitment
  totals DM1.65 billion ($967 million at current exchange rates) and represents
  one of the largest financial transactions in the history of Saxon industry.  The
  syndicate, led by Dresdner Bank AG, consists of 17 German and foreign banks.
  
         Current plans call for a total investment of approximately DM3 billion
  ($1.76 billion) through the year 2006.  AMD will contribute resources totaling
  DM550 million ($322 million).  German governmental support adds up to DM800
  million ($469 million) supplemented by an indemnity bond to partially secure the
  loan.
  
         The loan provides for the construction of an 875,000-square-foot chip
  fabrication facility and the establishment of a design center.  The wafer fab
  facility will include approximately 90,000 square feet of clean-room space
  dedicated to the manufacture of future generations of Windows compatible
  processors and other high-volume logic products.  Groundbreaking for the
  facility occurred in October of last year.
  
         The plan is for the Dresden megafab to begin production in 1999 and be
  capable of producing 6,000 eight-inch wafers per week at maximum capacity.
  
         This document contains forward-looking statements regarding Fab 30 that
  involve risks and uncertainties that could cause actual results to differ
  materially, including possible construction complications, the timely
  development and market acceptance of new products, the impact of competitive
  products and pricing, the timely development of wafer fabrication process
  technologies, the effect of changing economic conditions, and such risks and
  uncertainties detailed from time to time in the company's SEC reports.
  
  
  AMD, IS A TRADEMARK OF ADVANCED MICRO DEVICES, INC.
  
                                         2
  <PAGE>
   
                                     SIGNATURES
                                     ----------
  
           Pursuant to the requirements of the Securities Exchange Act of 1934,
  the registrant has duly caused this report to be signed on its behalf by the
  undersigned hereunto duly authorized.
  
                                   ADVANCED MICRO DEVICES, INC.
                                          (Registrant)
  
  
  
  Date:  April 3, 1997             By: /s/ GEOFF RIBAR
                                       ---------------------
                                       Geoff Ribar
                                       Vice President
                                       Corporate Controller
  
  
  
  
                                         3
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text: SECURITIES AND EXCHANGE COMMISSION
                               Washington, D.C. 20549
  
                                      FORM 8-K
  
                 Current Report Pursuant to Section 13 or 15(d) of
                        The Securities Exchange Act of 1934
  
         Date of Report (date of earliest event reported):   March 13, 1997
  
                            ADVANCED MICRO DEVICES, INC.
                            ----------------------------
               (Exact name of registrant as specified in its charter)
  
               DELAWARE                    1-7882                   94-1692300
  -------------------------------       -----------            ------------------
  (State or other jurisdiction          (Commission            (I.R.S. Employer
        of incorporation)               File Number)           Identification No.)
   
  
         One AMD Place
         P.O. Box 3453
         Sunnyvale, California                                       94088-3453
  ---------------------------------------                            ----------
  (address of principal executive offices)                           (Zip Code)
  
  Registrant's telephone number,
   including area code:                                 (408) 732-2400
                                                         -------------
  
                                    Page 1 of 3
  Item 5.  Other Events.
  -------  -------------
  
         On March 13, 1997, Advanced Micro Devices, Inc. announced that AMD
  officials and bank syndicate representatives meeting in Dresden, Germany, signed
  a loan agreement which will finance Fab 30, a new semiconductor wafer
  fabrication factory and research center to be built by AMD.  The loan commitment
  totals DM1.65 billion ($967 million at current exchange rates) and represents
  one of the largest financial transactions in the history of Saxon industry.  The
  syndicate, led by Dresdner Bank AG, consists of 17 German and foreign banks.
  
         Current plans call for a total investment of approximately DM3 billion
  ($1.76 billion) through the year 2006.  AMD will contribute resources totaling
  DM550 million ($322 million).  German governmental support adds up to DM800
  million ($469 million) supplemented by an indemnity bond to partially secure the
  loan.
  
         The loan provides for the construction of an 875,000-square-foot chip
  fabrication facility and the establishment of a design center.  The wafer fab
  facility will include approximately 90,000 square feet of clean-room space
  dedicated to the manufacture of future generations of Windows compatible
  processors and other high-volume logic products.  Groundbreaking for the
  facility occurred in October of last year.
  
         The plan is for the Dresden megafab to begin production in 1999 and be
  capable of producing 6,000 eight-inch wafers per week at maximum capacity.
  
         This document contains forward-looking statements regarding Fab 30 that
  involve risks and uncertainties that could cause actual results to differ
  materially, including possible construction complications, the timely
  development and market acceptance of new products, the impact of competitive
  products and pricing, the timely development of wafer fabrication process
  technologies, the effect of changing economic conditions, and such risks and
  uncertainties detailed from time to time in the company's SEC reports.
  
  AMD, IS A TRADEMARK OF ADVANCED MICRO DEVICES, INC.
  
                                         2
  SIGNATURES
                                     ----------
  
           Pursuant to the requirements of the Securities Exchange Act of 1934,
  the registrant has duly caused this report to be signed on its behalf by the
  undersigned hereunto duly authorized.
  
                                   ADVANCED MICRO DEVICES, INC.
                                          (Registrant)
  
  Date:  April 3, 1997             By: /s/ GEOFF RIBAR
                                       ---------------------
                                       Geoff Ribar
                                       Vice President
                                       Corporate Controller
  
                                         3